Job Details:

Job Description:

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

Job Summary:
We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.

Key Responsibilities:
• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and detailed drawings for:
o Substrates
o Integrated Heat Spreaders (IHS)
o Stiffeners
o Overall package assemblies
• Design process media trays used during various stages of the assembly process.
• Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
• Act as the single point of contact for all packaging mechanical design collateral needs.
• Proactively identify and solve design and process issues, ensuring timely project execution.

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Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Minimum Skills and Qualifications:
• US Citizenship required.
• Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.

• Bachelor's degree in mechanical engineering or in a STEM related field of study.

• 1+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD or similar 2D and 3D CAD software.

Preferred Skills:
• Master's degree in mechanical engineering or in a STEM related field of study.
• Solid mechanical design foundation and 3D spatial awareness.

• Excellent communication and interpersonal skills for effective cross-functional collaboration.

• Ability to interpret and generate technical drawings and specifications.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $105,650.00-149,150.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Mechanical Design Engineer – Semiconductor Packaging