Job Details:

Job Description:

Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.

About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.

Key Responsibilities

Process Innovation and Excellence

Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
Drive defectivity reduction and uniformity improvements through systematic process enhancement
Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
Optimize equipment performance working with internal teams and key suppliers

Strategic Technical Leadership

Align technical vision with customer requirements and business objectives
Synthesize complex technical data to formulate and execute strategic responses
Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
Deliver rapid execution of innovative solutions to meet challenging development timelines

Cross-Functional Partnership

Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
Present technical findings effectively to diverse audiences from engineering teams to executive leadership
Foster in-person collaboration to accelerate decision-making and problem resolution

Industry Leadership

Stay current with semiconductor industry trends and emerging process technologies
Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
Contribute to technology roadmaps through hands-on technical expertise and market insight

What We're Looking For

Technical Excellence

Results-driven professional with exceptional technical problem-solving abilities
Proven track record of significant accomplishments across multiple technology nodes
Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction
Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer

Leadership Capabilities

Outstanding communication skills for presenting complex technical information to varied audiences
Self-motivated with strong initiative and ability to navigate ambiguous technical challenges
Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus
Experience driving clarity in complex technical situations and leading cross-functional initiatives

Industry Expertise

Comprehensive knowledge of process development, materials science, and device physics
Ability to interpret industry trends and translate market dynamics into actionable technical strategies
Experience with foundry business models and customer engagement requirements
Proven capability to work independently while managing diverse technical assignments

Qualifications:

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through industry-related job experience. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
5+ years semiconductor industry experience with strong focus on thin film deposition processes
Proven experience in process development, technical leadership, and manufacturing engineering
Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
Fab startup experience across manufacturing, quality, R and D, and supply chain functions
Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Preferred Qualifications

Ph.D. in Electrical/ Mechanical or Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
Experience in Gate All Around (GAA) logic technologies within semiconductor foundry environments
Experience delivering customized solutions across Technology Development and HVM organizations
Cross-functional leadership experience managing diverse stakeholder groups
Semiconductor foundry experience

Why This Role Matters: This high-visibility position directly impacts Intel's foundry competitiveness and customer success. You will work on industry-defining technologies while building expertise that positions you as a leader in advanced semiconductor manufacturing.

Work Environment: This role emphasizes collaborative, in-person work to enable rapid innovation cycles and real-time problem resolution in Intel's state-of-the-art manufacturing facilities.

Ready to Shape the Future? Join Intel's mission to push the boundaries of semiconductor manufacturing technology. Your expertise will directly influence the next generation of computing innovations and manufacturing excellence.

Apply today to become part of our world-class MDCE team and help define the future of semiconductor technology.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Senior Member of Technical Staff, Thin Films Engineer